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Applications
- Photoresist removal
- Descum
- High dose implanted resist
- Non oxidizing metal processing
System Features
- Wafer size: 3§- 6§
- Single wafer processing
- Full cassette to cassette automation
- Table top or stand alone or thru wall system
- Downstream ashing
- Up to 4 MFC＊s
- Closed loop chamber temperature and lamp temperature controller
- Ash rates 2米-5米 /min for positive photoresist, less than 8米 for negative photoresist
- Selectivity to underlying films >1000:1
- Throughput up to 90 wafers per hour
- Particle control <0.05 particles/cm2 @0.3米
- Damage control <0.1 cv shift for 250? gate oxide
AIO Advantages
- Visual 每 15-inch LCD color touch screen monitor on ergonomic arm.
- Simplicity 每 System controlled using serial SECS port communication.
- One touch operation 每 starts wafer lot free from sequential recipe
entries and
operator mistakes.
- Security 每 4-level access: Operator, Maintenance, Process, and Administrator.
- Data Collection 每 Lot information, operator ID, start time, ending time, number
of wafers, process information per wafer (pressure, MFC actual values,
temperature setpoint / actual, etc.), alarm conditions, and data backup.
- Data Transfer 每 All data can be easily transferred to a host computer or server for
process, production, maintenance analysis, and archiving.
- User friendly 每 recipe writing and editing with descriptive alphanumeric file
names, unlimited number of recipes (OEM 16 recipes), recipe management,
touchscreen real-time display
- Temperature Control 每 Integrated closed-loop PID temperature control, out
of band alarm, graphical display of actual output values.
- Optional Barcode scanning automation 每 Fast and seamless, no buttons
to push or manually loaded erroneous recipes and process conditions.
Identifies all processing information including: run card, wafer lot
number, number of wafers, operator, process recipe, and virtually any
specified information.
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